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Samsung Begins Mass Production Of HBM2 4GB DRAM Package

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128GB 3D TSV DDR4 RDIMM

Samsung's new HBM solution will be used in high-performance computing (HPC), advanced graphics, network systems and enterprise servers, and is said to offer DRAM performance that is "seven times faster than the current DRAM performance limit". This is double the bandwidth of first-generation HBM and a seven-fold increase over a 36GB/s 4GB GDDR5 chip, which now has the fastest data speed-per-pin at 9Gbps.

Just a day back, Samsung has announced that it has begun mass-production of the world's first 4GB DRAM, which utilizes the latest bandwidth.

Samsung Electronics Co. said Tuesday it has started the mass production of new dynamic random access memory (DRAM) chips, targeting the high performance computing segment that covers super computers and big-data cloud services.

"Also, in using our 3D memory technology here, we can more proactively cope with the multifaceted needs of global IT while at the same time strengthening the foundation for future growth of the DRAM market", Sewon added.

Samsung is using the 20nm process and HBM chip design for its 4GB DRAM chips and is specifically aiming these at graphics cards as well as HPC systems.

The new RAM is produced by stacking a buffer die at the bottom with four 8-gigabit core dies on top. The latest bandwidth is based on the second-generation High Bandwidth Memory simply called as HBM2 interface.

JEDEC says there's also "a new pseudo channel architecture to improve effective bandwidth, and clarifications and enhancements to the test features" plus "a new feature to alert controllers when DRAM temperatures have exceeded a level considered acceptable for reliable operation so that the controller can take appropriate steps to return the system to normal operation".

On the matter of gaming, the new package's combination of high performance, energy efficiency and small dimensions make it flawless for next-gen graphics cards. Each is interconnected with microbumps and more than 5,000 TSV holes per layer.

Samsung said it also plans to produce an 8GB HBM2 DRAM package by the end of the year, allowing graphics card makers to save as much as 95 percent of space versus using GDDR5 DRAM.

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